Classification of IC Process Deformation Characteristics Using Memory Fail Bitmaps
نویسنده
چکیده
Building a portfolio of deformations is the key step for building better defect models for the test and yield learning domain. A viable approach to achieve this goal is through geometric characterization and classification of failure patterns found on memory fail bitmaps. In this paper, we present preliminary results on how to build such a portfolio of deformations for an IC technology of interest based on a fail bitmap analysis study conducted on large, modern SRAM memory products.
منابع مشابه
Analysis of IC Manufacturing Process Deformations: An Automated Approach Using SRAM Bit Fail Maps
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